JPL JET PROPULSION LABRATORY
Flight Electronics Integration Facility (FEIF) Building,
PLANNET helped JPL create the-state -of-the-art wired and
wireless cable infrastucture, audiovisual syatems, and security
systems for their first 100% new laboratory facility in 30 years.
The new 5-story 88,000 SF LEED Gold building includes:
design of laboratory spaces for electronic and microelectronic
engineering, fabrication, testing and assembling to support
missions across JPL.
PLANNET's work included design, bid management and construction
administration of: wired/wireless voice/data cable infrastructure for
Outside Plant (OSP) and interiors. design of the technology rooms,
audiovisual systems and security systems.
JPL Walkway View JPL OverheadView

PROJECT DETAILS

    Markets

  • Corporate

    Services

  • Physical Security
  • Cabling Infrastructure
  • Audiovisual

  • Technology Consulting & Design

Other Info

  • 88,000 SF

  • Pasadena, CA

  • LEED Silver certified

  • JPL’s first new laboratory in 30 years

  • Multiple Laboratories and testing spaces

JET PROPULSION LABORATORY (JPL)

PLANNET has been engaged with JPL on various critical projects including the Flight Projects Building, a ground-up 129,000 SF multi-level building;  Building 301, a 40,000 SF TI building; Building 303, a 40,000 SF TI building; and the most recent Flight Electronics Integration Facility (FEIF) Building, a ground-up 5-story 88,000 SF LEED Gold building in Pasadena, CA.

Every project with JPL is noteworthy, but a real standout is the FEIF Building, which is JPL’s first 100% new laboratory facility in 30 years. The new 5-story 88,000 SF LEED Gold building includes the design of laboratory spaces for electronic and microelectronic engineering, fabrication, testing, and assembly to support missions across JPL. The facility includes Class 10K cleanrooms, support ancillary work areas for parts storage, fabrication, integration and testing, research, prototype labs to support R&D development, and office and meeting space for collaborative multidivisional teams involved in advanced electronic fabrication.

PLANNET’s scope of work included design, bid management and construction administration of: wired/wireless voice/data cable infrastructure for Outside Plant (OSP) and interiors. Also in scope was the design of the technology rooms, audiovisual systems and security systems.

Related Projects

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